Figure 13-6. 180-Pin µBGA Physical Layout with Pinout—Topside View
Table 13-5. 180-Pin µBGA Six-Layer Board Routing Example (Four Routing Layers)—Sample Parameters
| Routing Layer Parameters | Via Size (mm) | Other Parameters | Via Size (mm) |
| Component Side | 0.509 | Land Pad Side | 0.350 |
| First Inside Layer | 0.634 | Solder Mask Opening | 0.549 |
| Second Inside Layer | 0.634 | Trace Width | 0.127 |
| Solder Side | 0.634 | Drill Size for the Via | 0.254 |
| Hole Side for the Via | 0.152 |
Via Solder Trace
Solder Pad
Figure 13-7. 180-Pin µBGA Six-Layer Board Routing Example (Four Routing Layers)—Component Side
Figure 13-8. 180-Pin µBGA Six-Layer Board Routing Example (Four Routing Layers)—First Inside Layer
Figure 13-9. 180-Pin µBGA Six-Layer Board Routing Example (Four Routing Layers)— Second Inside Layer
Figure 13-10. 180-Pin µBGA Six-Layer Board Routing Example (Four Routing Layers)—Solder Side
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| Figure 13-5. 180-Pin µBGA PCB Layout Suggested Land Pattern | | | Address |