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| Symbol | Term | Definition | Symbol | Term | Definition |
| E | Package width | Width of package | C | Lead thickness | Thickness of lead (excluding surface plating) |
| D | Package length | Length of package | q | Lead angle | Angle of leads versus seating plane |
| A | Mounting height | Height from the ground plane to the top of the package | q2, q3 | Chamfer angle | Package chamfer angle |
| A1 | Standoff height | Height from the ground plane to the bottom edge of the package (PGA) | L, L1, L2 | Lead length or length of flat lead section | Lead length or length of flat lead section |
| A2 | Package height | Height of the package (excluding warp of package) | HE | Overall width | Width including leads |
| e | Linear lead pitch | Theoretical lead pitch | HD | Overall length | Length |
| b | Lead width | Lead width or diameter (excluding surface plating) | R, R1 | Reverse bending | Reverse bending type |
Pad Width 0.3048 mm
Fiducial
Metal Pad
1.016 mm
Pad Length
1.524 mm
Solder Mask Keepout Area
2.54 mm
B = 27.178 mm
Fiducial
Pad Pitch = 0.500 mm A = 27.178 mm
Figure 13-2. 176-Pin PQFP PCB Layout Suggested Land Pattern
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AD29 VSS
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| Table 12-7. AC Electrical Characteristics (Local Outputs) over Operating Range | | | Table 13-4. Symbol Definitions—µBGA Package |