Basic structure

A processor's major functional components are:

Bus Interface	The third execution unit in a Pentium, where non-integer calculations are performed.
Core	The Pentium has two on-chip caches of 8KB each, one for code and one for data, which are far quicker than the larger external secondary cache.
Floating Point Unit	This brings a mixture of code and data into the CPU, separates the two ready for use, and then recombines them and sends them back out.
Level 1 Cache	The branch prediction unit tries to guess which sequence will be executed each time the program contains a conditional jump, so that the Prefetch and Decode Unit can get the instructions ready in advance.

VI. Translate the sentences. Explain the usage of Predicates in Passive.

1. Video card is inserted into your computer to make the graphics more pleasurable to the eye. 2. The processor's logic gates work together to make decisions using Boolean logic, which is based on the algebraic system established by mathematician George Boole. 3. Random Access Memory can be upgraded to help increase speed and performance. 4. These CPUs are also prime examples of the two competing CPU architectures of the last two decades – the former being classed as a CISC chip and the latter as a RISC chip. 5. In fact Intel's own 8086 was more powerful and had been released earlier. 6. At the time that the original PC was designed, most of the interface chips available were intended for use in 8-bit designs. 7. Typically dozens of microprocessors are made on a single wafer. 8. The circuitry is built up in layers. 9. Layers are made from a variety of substances. 10. When bare silicon is exposed, it can be bombarded with ions to produce transistors - this is called doping. 11. After exposure, developing removes those portions of the photo resist which had been exposed to light, leaving a mask through which etching can take place. 12. Microprocessors are manufactured in "clean rooms" - ultra-clean environments where the operators wear space-age protective suits. 13. As soon as all the layers have been added to a wafer, each chip is tested and any offenders are marked. 14. The individual chips are now separated, and at this point are called "dies". 15. The faulty ones are discarded, while the good ones are packaged in Pin Grid Arrays - the ceramic rectangles with rows of pins on the bottom which most people think of as microprocessors.

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