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Table 13-4. Symbol Definitions—µBGA Package

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Symbol Term Definition Symbol Term Definition
  E   Package width   Width of package   A1   Ball height Height from the ground plane to the bottom edge of the package (PGA)
D Package length Length of package e Ball pitch Theoretical lead pitch
  A   Height Height from the ground plane to the top of the package   b   Ball width Ball width or diameter (excluding surface plating)

 

 

Topside View

 

Copper Crop Lines (Allows for visual inspection of whether the

µBGA is centered on the pads)

 

0.8 mm

 

 

13 mm

 

 

0.25 mm

 

 


 

 

Detail of Each Pad and Breakout

 

0.508 mm Via Pad Diameter


 

 

Pin A1

 

Pin A1 Designator (Silkscreen)

 

0.15 mm FHS


 

13 mm


 

Solder Mask

 

 

0.35 mm Diameter Land


1.27 mm


 

Creating a solder mask clearance using the Via pad is not recommended.


 

 

Solder Mask Keepout 0.05–0.07 mm


 

 


Дата добавления: 2015-07-10; просмотров: 141 | Нарушение авторских прав


Читайте в этой же книге: Register 10-59. (CNTRL; 50h) PCI Target Response, Serial EEPROM, and Initialization Control | Register 10-60. (GPIOC; 54h) General Purpose I/O Control | Register 10-61. (PMDATASEL; 70h) Hidden 1 Power Management Data Select | Table 11-2. Input Pin Pull-Up and Pull-Down Resistor Requirements | Pull-Up and Pull-Down Resistor Recomme Pin Description | Table 11-8. Test and Debug Pins | Table 11-11. Multiplexed Bus Mode Interface Pins | Table 12-5. Electrical Characteristics over Operating Range | Table 12-6. AC Electrical Characteristics (Local Inputs) over Operating Range | Table 12-7. AC Electrical Characteristics (Local Outputs) over Operating Range |
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Table 13-2. Symbol Definitions—PQFP Package| Figure 13-5. 180-Pin µBGA PCB Layout Suggested Land Pattern

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