Table 13-4. Symbol Definitions—µBGA Package

Symbol	Term	Definition	Symbol	Term	Definition
E	Package width	Width of package	A1	Ball height	Height from the ground plane to the bottom edge of the package (PGA)
D	Package length	Length of package	e	Ball pitch	Theoretical lead pitch
A	Height	Height from the ground plane to the top of the package	b	Ball width	Ball width or diameter (excluding surface plating)

Topside View

Copper Crop Lines (Allows for visual inspection of whether the

µBGA is centered on the pads)

0.8 mm

13 mm

0.25 mm

Detail of Each Pad and Breakout

0.508 mm Via Pad Diameter

Pin A1

Pin A1 Designator (Silkscreen)

0.15 mm FHS

13 mm

Solder Mask

0.35 mm Diameter Land

1.27 mm

Creating a solder mask clearance using the Via pad is not recommended.

Solder Mask Keepout 0.05–0.07 mm

Дата добавления: 2015-07-10